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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                BGA rework station with optical alignment, ZM-R7220A BGA rework machine, PCB depaneling BGA station
                              

Điện áp:	220V	Quyền lực:	5650W
Cân nặng:	76kg	Kích thước:	685633850mm
Công suất sưởi hàng đầu:	1450W	Công suất máy sưởi dưới cùng:	1200W
Công suất máy sưởi IR:	2700W	Độ chính xác nhiệt độ:	± 3
Kích thước PCB tối đa:	415×370mm	Kích thước PCB tối thiểu:	6×6mm
Tối đa chip BGA:	60×60mm	chip BGA tối thiểu:	2×2mm
Gắn độ chính xác:	± 0,02mm	Độ phóng đại quang học:	230X
Tính thường xuyên:	50/60Hz

Điện áp:	220V
Quyền lực:	5650W
Cân nặng:	76kg
Kích thước:	685633850mm
Công suất sưởi hàng đầu:	1450W
Công suất máy sưởi dưới cùng:	1200W
Công suất máy sưởi IR:	2700W
Độ chính xác nhiệt độ:	± 3
Kích thước PCB tối đa:	415×370mm
Kích thước PCB tối thiểu:	6×6mm
Tối đa chip BGA:	60×60mm
chip BGA tối thiểu:	2×2mm
Gắn độ chính xác:	± 0,02mm
Độ phóng đại quang học:	230X
Tính thường xuyên:	50/60Hz

High Quality ZM-R7220A BGA rework station with optical alignment

ZM-R7220A BGA Rework Station with Optical Alignment

Product Applications

This high-precision BGA rework station is designed for professional PCB repair and component replacement applications:

De-solder and solder all types of BGA components (lead-free and leaded)
Remove and repair motherboard BGA IC chips and other components
Reduce production costs by reworking defective solder joints during PCB assembly
Rework micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, and other chipset types
Ideal for high-precision motherboard rework in laptops, gaming consoles, mobile phones, and electronic devices

Key Features

Advanced Heating System

Large area infrared carbon fiber pre-heating system for fast, even heating without light pollution
Independent control of top, bottom, and IR heaters with ±3℃ temperature accuracy
Ten-segment temperature control process suitable for all BGA rework applications
Adjustable IR preheating area for uniform PCB heating

Precision Optical Alignment

Adjustable CCD color optical system with beam split, zoom, and micro-adjust functions
Automatic chromatism resolution and brightness adjustment
230X magnification with mounting accuracy within ±0.02mm
Prevents eye strain during extended rework sessions

Smart Operation System

High-definition human-machine interface with authority-protected temperature parameters
Automatic soldering and de-soldering functions with no manual adjustment required
Unlimited temperature profile storage with one-key recall capability
USB connection with driver-free PC control
360° rotating BGA nozzle system with easy installation and replacement

Safety & Protection

CE certified with comprehensive safety protection functions
Automatic power-off circuit when temperature exceeds control limits
Password-protected temperature parameters to prevent unauthorized changes
Completion alarms and double protection systems
Protects PCB components and machine from damage during abnormal conditions

Technical Specifications

Power Supply	AC 220V ±10%, 50/60 Hz
Total Power	Max 5650W
Heater Power	Top: 1450W, Bottom: 1200W, IR: 2700W
Temperature Control	K-type thermocouple (Closed Loop), ±3℃ accuracy
PCB Size Range	Max: 415 × 370 mm, Min: 6 × 6 mm
BGA Chip Size	Max: 60 × 60 mm, Min: 2 × 2 mm
Positioning System	V-groove PCB support with universal fixture
Dimensions	685 × 633 × 850 mm (L × W × H)
Weight	76 kg
Color	White